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Powder Metallurgy Molybdenum Copper Composite Dia15mm Rod Sheet Plate
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xProduct Details
| Name | Molybdenum Copper Composite Material Dia15mm Rod Sheet Plate For Instrumentation Component Material | Material | Molybdenum Copper Alloy |
|---|---|---|---|
| Shape | Rod,sheet,plate,process Parts | Grade | MoCu50,MoCu40,MoCu30,MoCu20 |
| Hardness | 140HV | Surface | Bright |
| Size | As Per Customer Request | Export Port | Any Port In China |
| Highlight | Powder Metallurgy Molybdenum Copper Composite,Dia 15mm Molybdenum Copper Composite,140 HV Molybdenum Copper Composite |
||
Product Description
Molybdenum Copper Composite Material Dia15mm Rod Sheet Plate For Instrumentation Component Material
1. Description Of Molybdenum Copper Composite Material:
The molybdenum-copper composite material (alloy) has high density (≥99%), and the molybdenum content can be adjusted arbitrarily. The alloy has good electrical and thermal conductivity, low adjustable thermal expansion coefficient, non-magnetic and other physical properties, and has special high temperature performance, low gas content and good air tightness, as well as good machinability and weldability. Molybdenum-copper alloys have been widely used in electrical alloys for high-voltage vacuum switches, heat sink materials for microelectronic packaging, and instrumentation components.
2. Specification Of Molybdenum Copper Composite Material:
| Rod | dia2~100mm * Length <1500mm |
| Sheet | thickness 0.5~10mm*width 50~500mm*Length 50~1000mm |
| Special parts | as per customer drawing |
3.Technical Parameters Of Molybdenum Copper Composite Material:
| Grade |
Mo content wt% |
Density g/cm³ |
Thermal conductivity W/m-K |
Thermal expansion coefficient 10-6/K |
Conductivity IACA% |
Hardness HV |
| MoCu50 | 50±2 | 9.54 | 250~268 | 11.3 | >55 | 140 |
| MoCu40 | 60±2 | 9.62 | 216~248 | 10.1 | >55 | 156 |
| MoCu30 | 70±2 | 9.72 | 170~205 | 8.4 | >45 | 172 |
| MoCu20 | 80±2 | 9.85 | 160~190 | 7.3 | >40 | 225 |
Corrosion resistance: acid resistance, alkali resistance, salt water corrosion resistance
4.Process craft Of Molybdenum Copper Composite Material:
Using powder metallurgy technology, the production of molybdenum-copper alloy is completed in strict accordance with ISO 9001 and GJB 9001C quality standards, and the products fully meet the requirements of structural materials for electric vacuum devices.
Molybdenum-copper series alloy bars and thick plates can be produced by isostatic pressing + infiltration technology, various plates, foils and their parts can be produced by precision rolling technology, and various grades of molybdenum can be provided for domestic and foreign users Copper alloy technology has reached the domestic and international advanced level.
5.Advantage Of Molybdenum Copper Composite Material:
High strength: The tensile strength of molybdenum-copper composite material is higher than that of tungsten or copper alone, and it has good durability and stability.
High thermal conductivity: Molybdenum-copper composite materials have good thermal conductivity, can effectively diffuse and disperse heat, and are suitable for high-temperature electronic devices and other fields.
Corrosion resistance: Molybdenum-copper composite materials have excellent corrosion resistance and can be used stably for a long time in corrosive environments such as acid, alkali, and salt water.
Good machinability: molybdenum-copper composite materials can be processed by cold cutting, hot cutting, drilling, welding, etc., and have good processing performance and formability.
6. Application Of Molybdenum Copper Composite Material:
High-temperature electronic devices: Molybdenum-copper composite materials can be used to manufacture high-power LED radiators, high-frequency inductors, high-temperature electronic tubes and other electronic devices.
Aerospace field: Molybdenum-copper composite materials can be used to manufacture aero-engine parts, missile parts, satellite parts, etc.
Other fields: Molybdenum-copper composite materials can also be used to manufacture X-ray tubes, semiconductor packaging substrates, vacuum devices, etc.
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